Numerical modeling of wood-adhesive bond-line in mode II for beech wood glued by various adhesives

Authors

• Václav Sebera InnoRenew CoE
• Jaka Gašper Pečnik InnoRenew CoE; University of Primorska
• Boris Azinovič Slovenian National Building and Civil Engineering Institute
• Miha Kramar Slovenian National Building and Civil Engineering Institute