Numerical modeling of wood-adhesive bond-line in mode II for beech wood glued by various adhesives Authors Václav Sebera InnoRenew CoE image/svg+xml Jaka Gašper Pečnik InnoRenew CoE; University of Primorska Boris Azinovič Slovenian National Building and Civil Engineering Institute image/svg+xml Miha Kramar Slovenian National Building and Civil Engineering Institute image/svg+xml Downloads pdf Published 2019-05-03 Issue 2019: Book of abstracts: CompWood 2019 Section Brittle failure of wood
